
Next-Generation Memory Market Overview: Trends and Outlook 2034
Global Next-Generation Memory Market Growth, Size, Trends Analysis- By Technology, By Water Size, By Application - Regional Outlook, Competitive Strategies and Segment Forecast to 2034
Published: Jun-2025 | Report ID: IACT2584 | Pages: 1 - 250 | Formats*: |
Category : Information & Communications Technology |


Report Metric | Details |
Market size available for years | 2021-2034 |
Base year considered | 2024 |
Forecast period | 2025-2034 |
Segments covered | By Technology, By Water Size, By Application |
Regions covered | North America, Latin America, Asia-Pacific, Europe, and Middle East & Africa |
Companies Covered | Samsung, Micron Technology, Inc., Fujitsu, SK HYNIX INC, Honeywell International Inc., Microchip Technology Inc, Everspin Technologies Inc, Infineon Technologies AG, Kingston Technology Europe Co LLP, KIOXIA Singapore Pte. Ltd. |
- Global Next-Generation Memory Market Size (FY’2021-FY’2034)
- Overview of Global Next-Generation Memory Market
- Segmentation of Global Next-Generation Memory Market By Technology (Volatile, Non-Volatile)
- Segmentation of Global Next-Generation Memory Market By Wafer Size (200 mm, 300 mm)
- Segmentation of Global Next-Generation Memory Market By Application (BFSI, Consumer Electronics, Government, Telecommunications, Information Technology, Others)
- Statistical Snap of Global Next-Generation Memory Market
- Expansion Analysis of Global Next-Generation Memory Market
- Problems and Obstacles in Global Next-Generation Memory Market
- Competitive Landscape in the Global Next-Generation Memory Market
- Details on Current Investment in Global Next-Generation Memory Market
- Competitive Analysis of Global Next-Generation Memory Market
- Prominent Players in the Global Next-Generation Memory Market
- SWOT Analysis of Global Next-Generation Memory Market
- Global Next-Generation Memory Market Future Outlook and Projections (FY’2025-FY’2034)
- Recommendations from Analyst
1.1.Scope of the report1.2.Market segment analysis
2.1.Research data source
2.1.1.Secondary Data2.1.2.Primary Data2.1.3.SPERs internal database2.1.4.Premium insight from KOLs
2.2.Market size estimation
2.2.1.Top-down and Bottom-up approach
2.3.Data triangulation
4.1.Driver, Restraint, Opportunity and Challenges analysis
4.1.1.Drivers4.1.2.Restraints4.1.3.Opportunities4.1.4.Challenges
5.1.SWOT Analysis
5.1.1.Strengths5.1.2.Weaknesses5.1.3.Opportunities5.1.4.Threats
5.2.PESTEL Analysis
5.2.1.Political Landscape5.2.2.Economic Landscape5.2.3.Social Landscape5.2.4.Technological Landscape5.2.5.Environmental Landscape5.2.6.Legal Landscape
5.3.PORTERs Five Forces
5.3.1.Bargaining power of suppliers5.3.2.Bargaining power of buyers5.3.3.Threat of Substitute5.3.4.Threat of new entrant5.3.5.Competitive rivalry
5.4.Heat Map Analysis
6.1.Global Next-Generation Memory Market Manufacturing Base Distribution, Sales Area, Product Type6.2.Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Global Next-Generation Memory Market
7.1.Volatile
7.1.1.SRAM7.1.2.Magneto-Resistive Random-Access Memory (MRAM)7.1.3.Ferroelectric RAM (FRAM)7.1.4.Resistive Random-Access Memory (ReRAM)7.1.5.Nano RAM7.1.6.Other
7.2.Non-volatile
7.2.1.Hybrid Memory Cube (HMC)7.2.2.High-bandwidth Memory (HBM)
8.1.200 mm8.2.300 mm
9.1.BFSI9.2.Consumer Electronics9.3.Government9.4.Telecommunications9.5.Information Technology9.6.Others
10.1.Global Next-Generation Memory Market Size and Market Share
11.1.Asia-Pacific
11.1.1.Australia11.1.2.China11.1.3.India11.1.4.Japan11.1.5.South Korea11.1.6.Rest of Asia-Pacific
11.2.Europe
11.2.1.France11.2.2.Germany11.2.3.Italy11.2.4.Spain11.2.5.United Kingdom11.2.6.Rest of Europe
11.3.Middle East and Africa
11.3.1.Kingdom of Saudi Arabia11.3.2.United Arab Emirates11.3.3.Qatar11.3.4.South Africa11.3.5.Egypt11.3.6.Morocco11.3.7.Nigeria11.3.8.Rest of Middle-East and Africa
11.4.North America
11.4.1.Canada11.4.2.Mexico11.4.3.United States
11.5.Latin America
11.5.1.Argentina11.5.2.Brazil11.5.3.Rest of Latin America
12.1.Samsung
12.1.1.Company details12.1.2.Financial outlook12.1.3.Product summary12.1.4.Recent developments
12.2.Micron Technology, Inc.
12.2.1.Company details12.2.2.Financial outlook12.2.3.Product summary12.2.4.Recent developments
12.3.Fujitsu
12.3.1.Company details12.3.2.Financial outlook12.3.3.Product summary12.3.4.Recent developments
12.4.SK HYNIX INC
12.4.1.Company details12.4.2.Financial outlook12.4.3.Product summary12.4.4.Recent developments
12.5.Honeywell International Inc.
12.5.1.Company details12.5.2.Financial outlook12.5.3.Product summary12.5.4.Recent developments
12.6.Microchip Technology Inc
12.6.1.Company details12.6.2.Financial outlook12.6.3.Product summary12.6.4.Recent developments
12.7.Everspin Technologies Inc
12.7.1.Company details12.7.2.Financial outlook12.7.3.Product summary12.7.4.Recent developments
12.8.Infineon Technologies AG
12.8.1.Company details12.8.2.Financial outlook12.8.3.Product summary12.8.4.Recent developments
12.9.Kingston Technology Europe Co LLP
12.9.1.Company details12.9.2.Financial outlook12.9.3.Product summary12.9.4.Recent developments
12.10.KIOXIA Singapore Pte. Ltd
12.10.1.Company details12.10.2.Financial outlook12.10.3.Product summary12.10.4.Recent developments
12.11.Others
SPER Market Research’s methodology uses great emphasis on primary research to ensure that the market intelligence insights are up to date, reliable and accurate. Primary interviews are done with players involved in each phase of a supply chain to analyze the market forecasting. The secondary research method is used to help you fully understand how the future markets and the spending patterns look likes.
The report is based on in-depth qualitative and quantitative analysis of the Product Market. The quantitative analysis involves the application of various projection and sampling techniques. The qualitative analysis involves primary interviews, surveys, and vendor briefings. The data gathered as a result of these processes are validated through experts opinion. Our research methodology entails an ideal mixture of primary and secondary initiatives.
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