Next-Generation Memory Market Overview: Trends and Outlook 2034

Global Next-Generation Memory Market Growth, Size, Trends Analysis- By Technology, By Water Size, By Application - Regional Outlook, Competitive Strategies and Segment Forecast to 2034

Published: Jun-2025 Report ID: IACT2584 Pages: 1 - 250 Formats*:     
Category : Information & Communications Technology
Global Next-Generation Memory Market Introduction and Overview

According to SPER Market Research, the Global Next-Generation Memory Market is estimated to reach USD 47.06 billion by 2034 with a CAGR 17.86%.

The report includes an in-depth analysis of the Global Next-Generation Memory Market, including market size and trends, product mix, Applications, and supplier analysis. In recent years, the next-generation memory technologies market has experienced significant growth, fueled by the increasing demand for faster, more efficient, and cost-effective memory solutions. Innovations in MRAM, ReRAM, and PCRAM, along with AI and IoT integration, are accelerating adoption across sectors like consumer electronics, automotive, and enterprise storage. Economic considerations such as R&D investments, cost efficiency, and supply chain factors, combined with advancements like Micron’s GDDR7, are propelling the market forward with enhanced performance, power efficiency, and miniaturization. However, The next-generation memory market faces challenges such as high production costs, complex manufacturing processes, and limited scalability. Additionally, compatibility issues with existing systems and supply chain disruptions hinder widespread adoption.
By Technology:
The next-generation memory market is categorized into volatile and non-volatile technologies, with non-volatile memory generating the highest global revenue. Key types include Hybrid Memory Cube and High-Bandwidth Memory. This segment is driven by the surge in data from cloud computing, IoT, and social media. In a recent development, researchers at Dongguk University created an optoelectronic memory device that addresses reliability and endurance challenges in traditional non-volatile memory technologies.

By Wafer Size:
The next-generation memory market is divided based on wafer size into two segments: 200 mm and 300 mm. In 2024, the 300 mm segment led in global revenue due to its superior production efficiency, allowing more chips per wafer, which enhances throughput and reduces per-chip manufacturing costs—ideal for high-volume production. In May 2024, STMicroelectronics and Samsung advanced this further by introducing automotive microcontrollers using ePCM with an 18nm FD-SOI process. Meanwhile, the 200 mm segment is projected to grow steadily, driven by ongoing technological improvements and cost advantages, making it a viable option for specific applications with lower production volume needs.

By Application:
The next-generation memory market is categorized by application into various sectors, including BFSI, consumer electronics, government, telecommunications, IT, and others. The BFSI sector has emerged as a leading contributor to market revenue, driven by its increasing reliance on advanced memory technologies for enhanced data security. These solutions offer strong encryption and resistance to cyber and physical threats, ensuring compliance with strict regulations and boosting trust. In a recent development, Infinidat introduced an upgraded InfiniBox G4 storage system, featuring faster performance, improved management tools, expanded cloud compatibility, and reinforced data protection capabilities through its InfiniSafe technology.

Regional Insights:
In 2024, North America held a substantial share of the global next-generation memory market, driven by rising adoption across sectors such as finance, healthcare, and cloud computing, where enhanced data processing is critical. Companies are increasingly implementing advanced memory solutions to address these evolving demands. For example, in early 2024, Shelly Group AD unveiled its latest Gen3 IoT devices at CES, featuring expanded memory capacity and improved functionality for smart home and business applications. Meanwhile, the Asia Pacific region led the market, fueled by its strong manufacturing base in countries like China, Japan, South Korea, and India. As a global manufacturing hub, Asia Pacific continues to advance Industry 4.0 initiatives, promoting innovation, efficiency, and sustainability across industrial and technological sectors.



Market Competitive Landscape:
The global Next-Generation Memory Market is highly consolidated, with several prominent players shaping the industry. Key companies include: Samsung, Micron Technology, Inc., Fujitsu, SK HYNIX INC, Honeywell International Inc., Microchip Technology Inc, Everspin Technologies Inc, Infineon Technologies AG, Kingston Technology Europe Co LLP, KIOXIA Singapore Pte. Ltd.

Recent Developments:
In April 2024, Samsung introduced its updated Evo Select and Evo Plus microSD memory cards in the U.S., featuring enhanced read speeds of up to 160 MB/s—30 MB/s faster than the 2023 models. These improved memory cards are engineered to deliver significantly faster data transfer, meeting the increasing consumer demand for high-speed, reliable storage solutions across a wide range of devices.
In May 2024, Micron Technology, Inc. announced the upcoming release of a new high-performance memory solution for data centers. Their 128GB DDR5 RDIMM delivers increased speed and capacity compared to earlier models, reaching data transfer rates of up to 5,600 MT/s. This innovation is designed to support the growing demands of modern data centers for efficient and powerful computing capabilities.

Scope of the report:
 Report Metric Details
 Market size available for years2021-2034
 Base year considered2024
 Forecast period2025-2034
 Segments coveredBy Technology, By Water Size, By Application
 Regions coveredNorth America, Latin America, Asia-Pacific, Europe, and Middle East & Africa
 Companies Covered
Samsung, Micron Technology, Inc., Fujitsu, SK HYNIX INC, Honeywell International Inc., Microchip Technology Inc, Everspin Technologies Inc, Infineon Technologies AG, Kingston Technology Europe Co LLP, KIOXIA Singapore Pte. Ltd.


Key Topics Covered in the Report
  • Global Next-Generation Memory Market Size (FY’2021-FY’2034)
  • Overview of Global Next-Generation Memory Market
  • Segmentation of Global Next-Generation Memory Market By Technology (Volatile, Non-Volatile)
  • Segmentation of Global Next-Generation Memory Market By Wafer Size (200 mm, 300 mm)
  • Segmentation of Global Next-Generation Memory Market By Application (BFSI, Consumer Electronics, Government, Telecommunications, Information Technology, Others)
  • Statistical Snap of Global Next-Generation Memory Market 
  • Expansion Analysis of Global Next-Generation Memory Market
  • Problems and Obstacles in Global Next-Generation Memory Market
  • Competitive Landscape in the Global Next-Generation Memory Market
  • Details on Current Investment in Global Next-Generation Memory Market
  • Competitive Analysis of Global Next-Generation Memory Market
  • Prominent Players in the Global Next-Generation Memory Market
  • SWOT Analysis of Global Next-Generation Memory Market
  • Global Next-Generation Memory Market Future Outlook and Projections (FY’2025-FY’2034)
  • Recommendations from Analyst
1.Introduction
1.1.Scope of the report
1.2.Market segment analysis 

2.Research Methodology
2.1.Research data source
2.1.1.Secondary Data
2.1.2.Primary Data
2.1.3.SPERs internal database
2.1.4.Premium insight from KOLs
2.2.Market size estimation
2.2.1.Top-down and Bottom-up approach
2.3.Data triangulation

3.Executive Summary

4.Market Dynamics
4.1.Driver, Restraint, Opportunity and Challenges analysis
4.1.1.Drivers
4.1.2.Restraints
4.1.3.Opportunities
4.1.4.Challenges

5.Market variable and outlook
5.1.SWOT Analysis
5.1.1.Strengths
5.1.2.Weaknesses
5.1.3.Opportunities
5.1.4.Threats
5.2.PESTEL Analysis
5.2.1.Political Landscape
5.2.2.Economic Landscape
5.2.3.Social Landscape
5.2.4.Technological Landscape
5.2.5.Environmental Landscape
5.2.6.Legal Landscape
5.3.PORTERs Five Forces 
5.3.1.Bargaining power of suppliers
5.3.2.Bargaining power of buyers
5.3.3.Threat of Substitute
5.3.4.Threat of new entrant
5.3.5.Competitive rivalry
5.4.Heat Map Analysis

6.Competitive Landscape
6.1.Global Next-Generation Memory Market Manufacturing Base Distribution, Sales Area, Product Type 
6.2.Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Global Next-Generation Memory Market

7.Global Next-Generation Memory Market, By Technology, (USD Million) 2021-2034 
7.1.Volatile
7.1.1.SRAM
7.1.2.Magneto-Resistive Random-Access Memory (MRAM)
7.1.3.Ferroelectric RAM (FRAM)
7.1.4.Resistive Random-Access Memory (ReRAM)
7.1.5.Nano RAM
7.1.6.Other
7.2.Non-volatile
7.2.1.Hybrid Memory Cube (HMC)
7.2.2.High-bandwidth Memory (HBM)

8.Global Next-Generation Memory Market, By Wafer Size, (USD Million) 2021-2034 
8.1.200 mm
8.2.300 mm

9.Global Next-Generation Memory Market, By Application, (USD Million) 2021-2034 
9.1.BFSI
9.2.Consumer Electronics
9.3.Government
9.4.Telecommunications
9.5.Information Technology
9.6.Others

10.Global Next-Generation Memory Market, (USD Million) 2021-2034 
10.1.Global Next-Generation Memory Market Size and Market Share

11.Global Next-Generation Memory Market, By Region, 2021-2034 (USD Million)
11.1.Asia-Pacific
11.1.1.Australia
11.1.2.China
11.1.3.India
11.1.4.Japan
11.1.5.South Korea
11.1.6.Rest of Asia-Pacific
11.2.Europe
11.2.1.France
11.2.2.Germany
11.2.3.Italy
11.2.4.Spain
11.2.5.United Kingdom
11.2.6.Rest of Europe
11.3.Middle East and Africa
11.3.1.Kingdom of Saudi Arabia 
11.3.2.United Arab Emirates
11.3.3.Qatar
11.3.4.South Africa
11.3.5.Egypt
11.3.6.Morocco
11.3.7.Nigeria
11.3.8.Rest of Middle-East and Africa
11.4.North America
11.4.1.Canada
11.4.2.Mexico
11.4.3.United States
11.5.Latin America
11.5.1.Argentina
11.5.2.Brazil
11.5.3.Rest of Latin America 

12.Company Profile
12.1.Samsung
12.1.1.Company details
12.1.2.Financial outlook
12.1.3.Product summary 
12.1.4.Recent developments
12.2.Micron Technology, Inc.
12.2.1.Company details
12.2.2.Financial outlook
12.2.3.Product summary 
12.2.4.Recent developments
12.3.Fujitsu
12.3.1.Company details
12.3.2.Financial outlook
12.3.3.Product summary 
12.3.4.Recent developments
12.4.SK HYNIX INC
12.4.1.Company details
12.4.2.Financial outlook
12.4.3.Product summary 
12.4.4.Recent developments
12.5.Honeywell International Inc.
12.5.1.Company details
12.5.2.Financial outlook
12.5.3.Product summary 
12.5.4.Recent developments
12.6.Microchip Technology Inc
12.6.1.Company details
12.6.2.Financial outlook
12.6.3.Product summary 
12.6.4.Recent developments
12.7.Everspin Technologies Inc
12.7.1.Company details
12.7.2.Financial outlook
12.7.3.Product summary 
12.7.4.Recent developments
12.8.Infineon Technologies AG
12.8.1.Company details
12.8.2.Financial outlook
12.8.3.Product summary 
12.8.4.Recent developments
12.9.Kingston Technology Europe Co LLP
12.9.1.Company details
12.9.2.Financial outlook
12.9.3.Product summary 
12.9.4.Recent developments
12.10.KIOXIA Singapore Pte. Ltd
12.10.1.Company details
12.10.2.Financial outlook
12.10.3.Product summary 
12.10.4.Recent developments
12.11.Others

13.Conclusion

14.List of Abbreviations

15.Reference Links

SPER Market Research’s methodology uses great emphasis on primary research to ensure that the market intelligence insights are up to date, reliable and accurate. Primary interviews are done with players involved in each phase of a supply chain to analyze the market forecasting. The secondary research method is used to help you fully understand how the future markets and the spending patterns look likes.

The report is based on in-depth qualitative and quantitative analysis of the Product Market. The quantitative analysis involves the application of various projection and sampling techniques. The qualitative analysis involves primary interviews, surveys, and vendor briefings.  The data gathered as a result of these processes are validated through experts opinion. Our research methodology entails an ideal mixture of primary and secondary initiatives.

SPER-Methodology-1

SPER-Methodology-2

SPER-Methodology-3


Frequently Asked Questions About This Report
Next-Generation Memory Market is projected to reach USD 47.06 billion by 2034, growing at a CAGR of of 17.86% during the forecast period.
Next-Generation Memory Market grew in Market size from 2025. The Market is expected to reach USD 47.06 billion by 2034, at a CAGR of 17.86% during the forecast period.
Next-Generation Memory Market CAGR of 17.86% during the forecast period.
You can get the sample pages by clicking the link - Click Here
Next-Generation Memory Market size is USD 47.06 billion from 2025 to 2034.
Next-Generation Memory Market is covered By Technology, By Water Size, By Application
The North America is anticipated to have the highest Market share in the Next-Generation Memory Market.
Samsung, Micron Technology, Inc., Fujitsu, SK HYNIX INC, Honeywell International Inc., Microchip Technology Inc, Everspin Technologies Inc, Infineon Technologies AG, Kingston Technology Europe Co LLP, KIOXIA Singapore Pte. Ltd.
The report includes an in-depth analysis of the Global Next-Generation Memory Market, including market size and trends, product mix, Applications, and supplier analysis.
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