Passive and Interconnecting Components Market Size and Growth 2034

Passive and Interconnecting Components Market Growth, Size, Trends Analysis - By Component, By Application - Regional Outlook, Competitive Strategies and Segment Forecast to 2034

Published: Aug-2025 Report ID: SEMI2563 Pages: 1 - 255 Formats*:     
Category : Semiconductor and Electronics
Passive and Interconnecting Components Market Introduction and Overview

According to SPER Market Research, the Global Passive and Interconnecting Components Market is estimated to reach USD 303.58 billion by 2034 with a CAGR of 5.36%.

The report includes an in-depth analysis of the Global Passive and Interconnecting Components Market, including market size and trends, product mix, Applications, and supplier analysis. The global Passive and Interconnecting Components market is expected to be worth USD 180.1 billion in 2024, with a CAGR of 5.36% between 2025 and 2034. The growth of the Passive and Interconnecting Components market is driven by ongoing urbanization and industrialization, coupled with the increasing use of these components in industries such as automotive, healthcare, consumer electronics, and industrial manufacturing. Furthermore, the rising demand for compact, lightweight, and energy-efficient electronic components in vehicles, medical devices, and wearable technology is expected to significantly propel market development. In addition, the global shift toward sustainable production practices and the increased adoption of advanced materials and miniaturized components in packaging, appliances, and electrical systems are further contributing to the market's expansion, reinforcing the need for reliable and high-performance passive and interconnecting solutions.
By Component Insights:
Interconnecting segment holds a dominant position in the market, driven by the growing need for reliable and secure methods of linking various electronic components within a circuit. These components, such as connectors, play a crucial role in ensuring efficient signal transmission and power distribution.

By Application Insights:
Consumer Electronics segment leads the market, driven by the rising demand for devices such as smartphones, tablets, laptops, and home appliances. This growth is fuelled by rapid technological advancements, increasing consumer spending on smart and connected devices, and the continuous evolution of compact, energy-efficient electronics.

Regional Insights:
The Asia Pacific market for Passive and Interconnecting Components held a prominent position in 2024, driven by rising demand across key industries such as automotive, healthcare, consumer electronics, and industrial manufacturing. These sectors rely heavily on components that offer durability, flexibility, and high performance, contributing to the region’s market growth. The market is expected to witness rapid expansion, supported by strong industrial development in countries like China, India, and those in Southeast Asia. Government initiatives aimed at boosting manufacturing capabilities—particularly in the automotive and electronics sectors—are further accelerating the demand for passive and interconnecting components across the region.

Passive and Interconnecting Components Market


Market Competitive Landscape:
The Global Passive and Interconnecting Components industry has major players, including Corporation, KYOCERA AVX Components Corporation, Murata Manufacturing Co., Ltd, NICHICON CORPORATION, SAMSUNG ELECTRO-MECHANICS, TAIYO YUDEN CO., LTD, TDK Corporation, TE Connectivity, Vishay Intertechnology, Inc, and YAGEO Group. These companies compete fiercely with each other and local firms that have strong distribution networks and knowledge of suppliers and regulations. KYOCERA AVX Components Corporation, a subsidiary of KYOCERA Corporation, is a leading manufacturer of advanced electronic components. Headquartered in Fountain Inn, South Carolina, USA, the company was originally established as AVX Corporation before becoming part of KYOCERA in 2021. It specializes in the production of passive electronic components, interconnect solutions, sensors, and control devices.

Recent Developments:
In February 2024, Samtec expanded its Edge Rate connector portfolio with the launch of the ERM6 and ERF6 Series. These connectors feature a denser mated set, a narrower width, and a low-profile height of just 5 mm, making them ideal for space-constrained applications. Engineered to support high-speed data transmission up to 56 Gbps PAM4, they are well-suited for advanced applications in embedded vision, industrial systems, instrumentation, and robotics.
In January 2024, Murata Manufacturing Co., Ltd. introduced the DFE2MCPH_JL series, a line of automotive-grade power inductors tailored for demanding automotive applications such as powertrain and safety equipment. Available in 0.33µH and 0.47µH variants, these inductors are engineered using Murata’s advanced material and manufacturing technologies.

Scope of the report:
 Report Metric Details
Market size available for years 2021-2034
Base year considered 2024
 Forecast period 2025-2034
Segments coveredBy Component, By Application
Regions coveredNorth America, Latin America, Asia-Pacific, Europe, and Middle East & Africa
Companies Covered
Hosiden Corporation, KYOCERA AVX Components Corporation, Murata Manufacturing Co., Ltd, NICHICON CORPORATION, SAMSUNG ELECTRO-MECHANICS, TAIYO YUDEN CO., LTD, TDK Corporation, TE Connectivity, Vishay Intertechnology, Inc, YAGEO Group.
Key Topics Covered in the Report:
  • Global Passive and Interconnecting Components Market Size (FY 2021-FY 2034)
  • Overview of Global Passive and Interconnecting Components Market
  • Segmentation of Global Passive and Interconnecting Components Market by Component (Passive, Interconnecting)
  • Segmentation of Global Passive and Interconnecting Components Market by Application (Consumer Electronics, IT and Telecommunication, Automative, Industrial, Healthcare, Others)
  • Statistical Snap of Global Passive and Interconnecting Components Market
  • Expansion Analysis of Global Passive and Interconnecting Components Market
  • Problems and Obstacles in Global Passive and Interconnecting Components Market
  • Competitive Landscape in the Global Passive and Interconnecting Components Market
  • Details on Current Investment in Global Passive and Interconnecting Components Market
  • Competitive Analysis of Global Passive and Interconnecting Components Market
  • Prominent Players in the Global Passive and Interconnecting Components Market
  • SWOT Analysis of Global Passive and Interconnecting Components Market
  • Global Passive and Interconnecting Components Market Future Outlook and Projections (FY 2025-FY 2034)
  • Recommendations from Analyst
1. Introduction
  • 1.1. Scope of the report
  • 1.2. Market segment analysis
2. Research Methodology
  • 2.1. Research data source
    • 2.1.1. Secondary Data
    • 2.1.2. Primary Data
    • 2.1.3. SPERs internal database
    • 2.1.4. Premium insight from KOLs
  • 2.2. Market size estimation
    • 2.2.1. Top-down and Bottom-up approach
  • 2.3. Data triangulation
3. Executive Summary

4. Market Dynamics
  • 4.1. Driver, Restraint, Opportunity and Challenges analysis
    • 4.1.1. Drivers
    • 4.1.2. Restraints
    • 4.1.3. Opportunities
    • 4.1.4. Challenges
5. Market variable and outlook
  • 5.1. SWOT Analysis
    • 5.1.1. Strengths
    • 5.1.2. Weaknesses
    • 5.1.3. Opportunities
    • 5.1.4. Threats
  • 5.2. PESTEL Analysis
    • 5.2.1. Political Landscape
    • 5.2.2. Economic Landscape
    • 5.2.3. Social Landscape
    • 5.2.4. Technological Landscape
    • 5.2.5. Environmental Landscape
    • 5.2.6. Legal Landscape
  • 5.3. PORTERs Five Forces 
    • 5.3.1. Bargaining power of suppliers
    • 5.3.2. Bargaining power of buyers
    • 5.3.3. Threat of Substitute
    • 5.3.4. Threat of new entrant
    • 5.3.5. Competitive rivalry
  • 5.4. Heat Map Analysis
6. Competitive Landscape
  • 6.1. Global Passive and Interconnecting Components Market Manufacturing Base Distribution, Sales Area, Product Type 
  • 6.2. Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Global Passive and Interconnecting Components Market
7. Global Passive and Interconnecting Components Market, By Component (USD Million) 2021-2034
  • 7.1. Passive
  • 7.2. Interconnecting
8. Global Passive and Interconnecting Components Market, By Application (USD Million) 2021-2034
  • 8.1. Consumer Electronics
  • 8.2. IT and Telecommunication
  • 8.3. Automative
  • 8.4. Industrial
  • 8.5. Healthcare
  • 8.6. Others
9. Global Passive and Interconnecting Components Market, (USD Million) 2021-2034
  • 9.1. Global Passive and Interconnecting Components Market Size and Market Share
10. Global Passive and Interconnecting Components Market, By Region, (USD Million) 2021-2034
  • 10.1. Asia-Pacific
    • 10.1.1. Australia
    • 10.1.2. China
    • 10.1.3. India
    • 10.1.4. Japan
    • 10.1.5. South Korea
    • 10.1.6. Rest of Asia-Pacific
  • 10.2. Europe
    • 10.2.1. France
    • 10.2.2. Germany
    • 10.2.3. Italy
    • 10.2.4. Spain
    • 10.2.5. United Kingdom
    • 10.2.6. Rest of Europe
  • 10.3. Middle East and Africa
    • 10.3.1. Kingdom of Saudi Arabia 
    • 10.3.2. United Arab Emirates
    • 10.3.3. Qatar
    • 10.3.4. South Africa
    • 10.3.5. Egypt
    • 10.3.6. Morocco
    • 10.3.7. Nigeria
    • 10.3.8. Rest of Middle-East and Africa
  • 10.4. North America
    • 10.4.1. Canada
    • 10.4.2. Mexico
    • 10.4.3. United States
  • 10.5. Latin America
    • 10.5.1. Argentina
    • 10.5.2. Brazil
    • 10.5.3. Rest of Latin America 
11. Company Profile
  • 11.1. Hosiden Corporation
    • 11.1.1. Company details
    • 11.1.2. Financial outlook
    • 11.1.3. Product summary 
    • 11.1.4. Recent developments
  • 11.2. KYOCERA AVX Components Corporation
    • 11.2.1. Company details
    • 11.2.2. Financial outlook
    • 11.2.3. Product summary 
    • 11.2.4. Recent developments
  • 11.3. Murata Manufacturing Co., Ltd
    • 11.3.1. Company details
    • 11.3.2. Financial outlook
    • 11.3.3. Product summary 
    • 11.3.4. Recent developments
  • 11.4. NICHICON CORPORATION
    • 11.4.1. Company details
    • 11.4.2. Financial outlook
    • 11.4.3. Product summary 
    • 11.4.4. Recent developments
  • 11.5. SAMSUNG ELECTRO-MECHANICS
    • 11.5.1. Company details
    • 11.5.2. Financial outlook
    • 11.5.3. Product summary 
    • 11.5.4. Recent developments
  • 11.6. TAIYO YUDEN CO., LTD
  • 11.6.1. Company details
  • 11.6.2. Financial outlook
  • 11.6.3. Product summary 
  • 11.6.4. Recent developments
  • 11.7. TDK Corporation
    • 11.7.1. Company details
    • 11.7.2. Financial outlook
    • 11.7.3. Product summary 
    • 11.7.4. Recent developments
  • 11.8. TE Connectivity
    • 11.8.1. Company details
    • 11.8.2. Financial outlook
    • 11.8.3. Product summary 
    • 11.8.4. Recent developments
  • 11.9. Vishay Intertechnology, Inc
    • 11.9.1. Company details
    • 11.9.2. Financial outlook
    • 11.9.3. Product summary 
    • 11.9.4. Recent developments
  • 11.10. YAGEO Group
    • 11.10.1. Company details
    • 11.10.2. Financial outlook
    • 11.10.3. Product summary 
    • 11.10.4. Recent developments
  • 11.11. Others
12. Conclusion

13. List of Abbreviations

14. Reference Links

SPER Market Research’s methodology uses great emphasis on primary research to ensure that the market intelligence insights are up to date, reliable and accurate. Primary interviews are done with players involved in each phase of a supply chain to analyze the market forecasting. The secondary research method is used to help you fully understand how the future markets and the spending patterns look likes.

The report is based on in-depth qualitative and quantitative analysis of the Product Market. The quantitative analysis involves the application of various projection and sampling techniques. The qualitative analysis involves primary interviews, surveys, and vendor briefings.  The data gathered as a result of these processes are validated through experts opinion. Our research methodology entails an ideal mixture of primary and secondary initiatives.

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Frequently Asked Questions About This Report
Passive and Interconnecting Components Market is projected to reach USD 303.58 billion by 2034, growing at a CAGR of of 5.36% during the forecast period.
Passive and Interconnecting Components Market grew in Market size from 2025. The Market is expected to reach USD 303.58 billion by 2034, at a CAGR of 5.36% during the forecast period.
Passive and Interconnecting Components Market CAGR of 5.36% during the forecast period.
Passive and Interconnecting Components Market size is USD 303.58 billionfrom 2025 to 2034.
Passive and Interconnecting Components Market is covered By Component, By Application
The North America, Latin America, Asia-Pacific, Europe, and Middle East & Africa is the highest Market share in the Passive and Interconnecting Components Market.
Hosiden Corporation, KYOCERA AVX Components Corporation, Murata Manufacturing Co., Ltd, NICHICON CORPORATION, SAMSUNG ELECTRO-MECHANICS, TAIYO YUDEN CO., LTD, TDK Corporation, TE Connectivity, Vishay Intertechnology, Inc, YAGEO Group.
The report includes an in-depth analysis of the Global Passive and Interconnecting Components Market, including market size and trends, product mix, Applications, and supplier analysis.
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